Parameters

Parameters are taken from the product and/or order. The Macaos Price Engine supports over 150 parameters, though not all parameters apply to all product types.

A parameter is an integer value, a floating-point value (real number), a logical value (true or false) or a string. Parameters are converted between these four types as shown:

Order parameters

Common parameters

[F] Area (dm²) – bound box area * order quantity
[F] Area, rounded up to whole m² (dm²) – Area rounded up to nearest whole m²
[F] Area/day – bound box area * order quantity / lead time
[I] Customer country
[I] Customer sales office ID
[I] Lead time (days)
[I] Number of packages – if items/pkg not specified then 10/pkg if qty<100 or 25/pkg
[I] Quantity
[F] Ship weight (kg) – product weight * order quantity (to commenced 0.1/0.5/1.0 kg)
[F] Product weight (kg) – product weight * order quantity
[S] Shipment method (if defined in Office settings)

Board parameters

[F] Board area (dm²) – board area * order quantity
[F] Hard gold area (dm²) – hard gold area * order quantity

Hole counts

[I] Through holes – holes * order quantity
[I] Through holes plated – holes * order quantity
[I] Through holes unplated – holes * order quantity
[I] Blind holes – holes * order quantity
[I] Blind holes on top side – holes * order quantity
[I] Blind holes on bottom side – holes * order quantity

Layer counts * order area

[F] Half-ounce (<=25µm) layer count * board area * order quantity
[F 1 ounce (26-40µm) layer count * board area * order quantity
[F] 1½ ounce (41-50µm) layer count * board area * order quantity
[F] 2 ounce (51-80µm) layer count * board area * order quantity
[F] 2½ ounce (81-85µm) layer count * board area * order quantity
[F] 3 ounce (86-120µm) layer count * board area * order quantity
[F] 4 ounce (121-155µm) layer count * board area * order quantity
[F] 5 ounce (156-190µm) layer count * board area * order quantity
[F] >5ounce (>190µm) layer count * board area * order quantity
[F] 1/1½ ounce (26-50µm) layer count * board area * order quantity
[F] 2/2½ ounce (51-85µm) layer count * board area * order quantity

[F] Rout length (m) – rout length * order quantity
[I] Rout quantity – rout quantity * order quantity

Test point counts

[I] Test points – test points * order quantity
[I] Test points on top side – test points * order quantity
[I] Test points on bottom side – test points * order quantity

Stencil parameters

[I] Hole count – holes * order quantity
[I] Step count – steps * order quantity

Test fixture parameters

[I] Hole count – holes * order quantity
[I] Alignment pin count – pins * order quantity
[I] Test pin count – pins * order quantity

Product parameters

Common parameters

Product identification

[S] Product article number
[S] Product based on – comma-list of product numbers
[S] Product description
[I] Product ID
[S] Product name
[S] Product number
[I] Product stackup/style – stackup id/stencil thickness id/etc
[S] OTS Product full description – full description of “off the shelf” product
[S] Previous purchase sites – comma-list of production site IDs

Product type

[B] Product is board
[B] Product is flex board – not rigid-flex
[B] Product is metal-based board
[B] Product is production panel
[B] Product is rigid board – not rigid-flex or metal-based
[B] Product is rigid-flex board
[B] Product is stencil – including licensed stencil
[B] Product is licensed stencil
[I] Product type ID

Product size

[F] Bound box area (dm²)
[F] Bound box long side (mm)
[F] Bound box short side (mm)
[F] Bound box x-dimension width (mm)
[F] Bound box y-dimension height (mm)
[I] Estimated weight (g)

Product options

[B] Product may be ordered – used to indicate customer may purchase product
[B] Exclude ship costs – used to indicate customer will pay shipping separately
[B] Pack by IPC-1601
[I] Items per package
[B] Product price disabled – used if product is invalid or not manufacturable
[I] Import source mode (1=Orcad, 2=GbrJob, otherwise 0)

Board specific parameters

[I] Cu layer count

Buildup properties

[S] Compact buildup descr – a Macaos-specific stackup specification
[I] Max Cu thickness (µm) – thickness of thickest layer
[I] Max inner Cu thickness (µm) – thickness of thickest inner layer
[I] Max outer Cu thickness (µm) – thickness of thickest outer layer
[B] Is free buildup – no thickness specified for individual dielectric layers
[S] Material descr – a text description of the laminate material
[B] Has special material – true if not FR-4
[I] Min Tg (°C)
[B] Is halogen free
[I] Min CTI
[I] Total thickness (µm)
[I] Half-ounce (<=25µm) layer count
[I] 1 ounce (26-40µm) layer count
[I] 1½ ounce (41-50µm) layer count
[I] 2 ounce (51-80µm) layer count
[I] 2½ ounce (81-85µm) layer count
[I] 3 ounce (86-120µm) layer count
[I] 4 ounce (121-155µm) layer count
[I] 5 ounce (156-190µm) layer count
[I] >5 ounce (>190µm) layer count
[I] 1/1½ ounce (26-50µm) layer count
[I] 2/2½ ounce (51-85µm) layer count

Masks and surface finish

[I] Legend top side color ID – see list of IDS
[I] Legend bottom side color ID – see list of IDS
[B] Has different legend colors
[I] Solder mask top side color ID – see list of IDS
[I] Solder mask bottom side color ID – see list of IDS
[B] Has different solder mask colors
[I] Surface finish ID – see list of IDS
[F] Hard gold area (cm²)
[I] Peel off layer count
[B] Has peel off on top side
[B] Has peel off on bottom side
[B] Has carbon print
[B] Has kapton tape

Mechanical processing

[F] Rout length (m)
[I] Rout path count
[F] Rout density (m/dm²)
[I] Min rout dia. (µm)
[I] Depth routing side count
[B] Has depth routing top
[B] Has depth routing bottom
[B] Has beveled edge
[I] Beveled edge angle (°)
[I] Beveled edge backoff (µm)
[B] Has castellated holes
[B] Has countersinked holes
[B] Has no Cu shaving allowed
[B] Has plated slots
[B] Has scoring

Other properties

[I] IPC performance class
[B] Has 25µm min hole plating
[B] Has eltest required
[B] Has impedance control
[B] Has UL Certified fabricator required
[B] Has X-out not allowed

Holes and tools

[I] Through hole count
[I] Through hole count plated
[I] Through hole count unplated
[I] Blind hole count
[I] Blind hole count on top side
[I] Blind hole count on bottom side
[I] Hole density (holes/dm²)
[I] Buried depth count
[B] Has microvias
[I] Via protection level – IPC-4761 Type 0 to 7

Tool counts

[I] Through tool count
[I] Through tool count plated
[I] Through tool count unplated
[I] Blind tool count
[I] Blind tool count on top side
[I] Blind tool count bottom side

Minimum features

[I] Min track or clearance (µm)
[I] Min track width (µm)
[I] Min track width outer layers (µm)
[I] Min track width inner layers (µm)
[I] Min clearance (µm)
[I] Min clearance outer layers (µm)
[I] Min clearance inner layers (µm)
[I] Min annular ring (µm)
[I] Min annular ring outer layers (µm)
[I] Min annular ring inner layers (µm)
[I] Min hole dia. through (µm)
[I] Min hole dia. blind (µm)
[I] Min hole dia. buried (µm)
[I] Min unplated hole/edge to Cu clearance (µm)

Other statistics

[F] Board area (dm²) – actual area of board
[I] Boards per panel
[I] Different products per panel – if multi-product panel
[I] Additional products per panel – one less than Different products per panel
[I] Test point count – openings in solder mask
[I] Test points on top side
[I] Test points on bottom side

Flex board properties

[I] Cover layer count
[B] Has cover layer on top side
[B] Has cover layer on bottom side
[I] Stiffener layer count
[B] Has stiffener on top side
[B] Has stiffener on bottom side

Rigid-flex properties

[I] Flex layer count

Metal-based board properties

[F] Min thermal conductivity (W/m-K)

Stencil specific parameters

[I] Stencil opening count – number of holes in stencil
[I] Stencil step count – number of reduced thicknesses in stencil
[I] Stencil thickness in µm
[I] Stencil frame type ID
[B] Has coated finish
[B] Has polished edges
[S] Layer (top, bottom or both) – as integer returns Top=0, Bottom=1, Both=2
[I] Desired pad reduction (%)
[S] List of D-codes used for fiducials
[I] Stencil A-size (<=A5 = 5, <=A4 = 4, <=A3 = 3, <=A2 = 2, >A2=1)

Test fixture specific parameters

[I] Drilled hole count – test pins + alignment pins + mounting holes
[I] Test pin count
[I] Alignment pin count
[I] Connector count – for box style fixture
[I] Test fixture thickness (µm)
[B] Is top side
[B] Has protective cover
[S] Description of connector

Mechanical part specific parameters

[I] Material paint color (-1=none, else Delphi TColor $GGBBRR)
[I] Material finish (0=unspecified, 1=matte, 2=gloss 3=rubbery soft touch)

Color and surface finish IDs

Style IDs